Military sensor specialist HENSOLDT and leading AM electronics provider Nano Dimension have announced the successful 3D printing and assembly of a double-sided ten layer PCB (printed circuit board). The “major breakthrough” is a step toward developing high-performance electronic components through additive means.
HENSOLDT hopes to develop the work further and apply the technology to military applications such as radar and optronics.
Thomas Müller, CEO at HENSOLDT, explains: “Military sensor solutions require performance and reliability levels far above those of commercial components. To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.” 3D printed ten layer circuit board. Photo via HENSOLDT. 3D printed circuit boards Additively manufactured electronics are useful for verifying the functionality of a newly designed electronic component before it is mass-produced. The agile and customizable nature of AM makes […]
Neotech AMT GmbH has been pioneering 3D Printed Electronics (3D PE) since 2009 and continues to push the boundaries in...